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Home-Datora un ofisa piederumi- Computer maintenance - TG-P-01
Thermal silicone pad for heatsinksHelps the heat dissipation from a CPU, chipset or processor to a heatsinkExcellent thermal impedancePerfect stability - will not separate, run, migrate, or bleedNon capacitive or electrically conductive
Dimensions: 100 x 100 x 1 mmNet weight: 23 gColor: greyThermal conductivity: 2.0 W/m-KSpecific gravity: 1.7 +0.1 g/cm3Hardness: 40 ± 5 Shore CContinuous use temp: -40 ... +250 °C Dielectric breakdown voltage: 3-5 KVDielectric constant: 4.5 - 5.5 1M HzVolume resistivity: >4.0 x 1011 Ohm.cmFlame rating: V-0Thermal impedance: 0.18 ... 0.25 °C-in2/W
CE Certificate (pdf file)
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website image (33 kb)
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